Display apparatus and electronic apparatus

ABSTRACT

Disclosed herein is a display apparatus, including: a foldable substrate; a pixel array section including a plurality of pixels disposed on the substrate and each including an electro-optical device; the foldable substrate being folded at a substrate end portion at least on one side thereof around the pixel array section; a peripheral circuit section disposed on the substrate end portion and adapted to drive the pixels of the pixel array section; and a pad section provided on the substrate end portion on which the peripheral circuit section is provided and adapted to electrically connect the peripheral circuit section to the outside of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a Continuation of application Ser. No. 16/046,219,filed Jul. 26, 2018, which is a Continuation of application Ser. No.15/666,523, filed Aug. 1, 2017, now U.S. Pat. No. 10,069,092, issuedSep. 4, 2018, which is a Continuation of U.S. application Ser. No.15/430,731, filed Feb. 13, 2017, now U.S. Pat. No. 9,755,168, issuedSep. 5, 2017, which is Continuation of U.S. application Ser. No.13/302,624, filed Nov. 22, 2011, now U.S. Pat. No. 9,608,215, issuedMar. 28, 2017, which claims priority to Japanese Patent Application No.JP 2010-276940, filed in the Japan Patent Office on Dec. 13, 2010, theentire contents of which are hereby incorporated by reference in theirentirety.

BACKGROUND

This technology relates to a display apparatus and an electronicapparatus, and particularly to a display apparatus wherein a pluralityof pixels each including an electro-optical element are disposed in rowsand columns or in a matrix and an electronic apparatus which includes adisplay apparatus.

In recent years, in the field of display apparatus for displaying animage, a display apparatus of a planar type, that is, of a flat paneltype in which a plurality of pixels or pixel circuits are disposed in amatrix has been popularized rapidly. As one of flat panel type displayapparatus, a display apparatus is available which uses, as a lightemitting element of a pixel, an electro-optical element of the currentdriven type which emits light of the luminance which varies in responseto the value of current flowing therethrough. As the current driven typeelectro-optical element, an organic EL element is known which makes useof a phenomenon that, if an electric field is applied to an organic thinfilm of an organic material, then it emits light utilizingelectroluminescence (EL) of the organic material.

An organic EL displaying element which uses an organic EL element as alight emitting element of pixels has such a characteristic as describedbelow. In particular, since the organic EL element can be driven with anapplication voltage of 10 V or less, the power consumption can besuppressed low. Further, since the organic EL element is a self-luminouselement, visibility of a displayed image is high in comparison with aliquid crystal display apparatus. Besides, since an illuminating membersuch as a backlight is not required, reduction in weight and thicknesscan be achieved readily. Furthermore, since the speed of response of theorganic EL element is approximately several μ seconds and is very high,an afterimage upon moving picture display does not appear.

The organic EL display apparatus can adopt any of a simple or passivematrix method and an active matrix method as a driving method similarlyto the liquid crystal display apparatus. However, although the passivematrix type display apparatus is simple in structure, since the lightemission period of the electro-optical element is reduced by increase ofthe number of scanning lines, or in other words, by increase of thenumber of pixels, there is a problem in that it is difficult toimplement a large-sized and high-definition display apparatus.

Therefore, in recent years, development of an active matrix type displayapparatus in which current to flow to an electro-optical element iscontrolled by an active element such as, for example, by an insulatedgate type electric field effect transistor provided in a pixel in whichthe electro-optical element is provided has been and is proceedingenergetically. As the insulated gate type electric field effecttransistor, a TFT (Thin Film Transistor) is used popularly. Since, inthe active matrix type display apparatus, the electro-optical elementcontinues light emission over a period of one display frame, it can beimplemented readily in a large size and high definition.

A pixel circuit including a current-driven type electro-optical elementwhich is driven by the active matrix method includes, in addition to theelectro-optical element, a driving circuit for driving theelectro-optical element. One of such driving circuits is disclosed, forexample, in Japanese Patent Laid-Open No. 2009-103868 (hereinafterreferred to as Patent Document 1). The driving circuit of PatentDocument 1 is incorporated in a pixel circuit and is configured from adriving transistor 22 for driving a current-driven type electro-opticalelement such as, for example, an organic EL element 21, a writingtransistor 23 and a retaining capacitor 24.

In Patent Document 1, an organic EL display apparatus 10 _(B) in whichperipheral circuit sections (40, 50 and 60) are mounted on a displaypanel 70 in which a pixel array section 30 configured from a greatnumber of unit pixels 20 _(b) is incorporated is disclosed (refer toparagraph 0027, FIGS. 1, 10 and so forth of Patent Document 1).

Further, in Patent Document 1, it is described to commonly use one powersupplying line 32 (32 ₋₁ to 32 _(-m)) for four subpixels 20 _(W), 20_(R), 20 _(G) and 20 _(B) which belong to two vertically neighboringrows which configure the same unit pixel 20 _(b). Furthermore, in PatentDocument 1, it is described that, since the circuit scale of the writingscanning circuit 40 can be reduced by commonly using one power supplyingline 32, reduction of the width of the molding of the framework of thedisplay panel 70 can be achieved (refer to paragraph 0136 of PatentDocument 1). Here, the “molding of the framework” is that region of thedisplay panel 70 around a pixel array section 30 which does notcontribute to image display.

SUMMARY

As described above, by reducing the number of circuit elements andwiring lines which configure the peripheral circuit sections for drivingpixels of the pixel array section to reduce the circuit scale of theperipheral circuit sections, reduction of the width of the frameworkmolding of the display panel can be achieved. However, since there is alimitation to reduction of the circuit scale by decrease of the numberof circuit elements and wiring lines which configure the peripheralcircuit sections, there is a limitation also to reduction of width ofthe framework molding of the display panel. Thus, if it is tried tosatisfy a demand for further reduction of the width of the work moldingof the display panel, then it is sometimes forced to restrict a functionof a peripheral circuit to achieve reduction of the circuit scale of theperipheral circuit section.

Therefore, it is desirable to provide a display apparatus and anelectronic apparatus by which further reduction of the width of theframework molding of a display panel can be achieved without restrictinga function of a peripheral circuit section which drives pixels of apixel array section.

According to the disclosed technology, there is provided a displayapparatus including a foldable substrate, a pixel array sectionincluding a plurality of pixels disposed on the substrate and eachincluding an electro-optical device, the foldable substrate being foldedat a substrate end portion at least on one side thereof around the pixelarray section, a peripheral circuit section disposed on the substrateend portion and adapted to drive the pixels of the pixel array section,and a pad section provided on the substrate end portion on which theperipheral circuit section is provided and adapted to electricallyconnect the peripheral circuit section to the outside of the substrate.

In the display apparatus having the configuration described above, sincethe substrate is folded at a substrate end portion at least on one sidethereof around the pixel array section, the region portion around thepixel array section which does not contribute to image display, that is,the framework molding, can be reduced in size by an amount correspondingto the region of the folded substrate end portion. Thereupon, theperipheral circuit section is positioned on the substrate on which thepixel array section is provided through the folding portion.Accordingly, even if contact portions such as terminals are notinterposed between the peripheral circuit section and the pixel arraysection, the peripheral circuit section and the pixel array section canbe electrically connected to each other.

Further, the size of the substrate end portion is not limited if itremains within the range of the size of the substrate main body on whichthe pixel array section is mounted. Accordingly, the scale of theperipheral circuit section disposed on the substrate end portion andhence a function of the peripheral circuit section are not limited.Besides, since the pad section for electrically connecting theperipheral circuit section and the outside of the board to each other isprovided on the substrate end portion on which the peripheral circuitsection is provided, the distance between the folding portion of thesubstrate end portion and the peripheral circuit section is small. Thus,even if wiring lines cannot be laid between them, electric connectionbetween the peripheral circuit section and the outside of the substratecan be carried out with certainty.

In summary, with the display apparatus, since a foldable substrate isused and a peripheral circuit section is disposed on a substrate endportion of the board folded at least on one side around the periphery ofa pixel array section, further reduction in width of the frameworkmolding of the display panel can be achieved without limiting anyfunction of the peripheral circuit section. Besides, even though thedistance between the folding portion of the substrate end portion andthe peripheral circuit section is so small that wiring lines cannot belaid between them, electric connection between the peripheral circuitsection and the outside of the substrate can be established withcertainty.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top plan view schematically showing a structure of a displaypanel of a display apparatus according to an embodiment of the presenttechnology;

FIGS. 2A and 2B are sectional views showing the display panel of FIG. 1before and after folding thereof, respectively;

FIG. 3 is a front elevational view schematically showing a differentstructure of the display panel of FIG. 1;

FIGS. 4A and 4B are schematic views of the display panel of FIG. 1before and after folding of a substrate end portion;

FIGS. 5A to 5D are schematic views illustrating an example of aprocedure of folding of substrate end portions;

FIG. 6 is a partial sectional view showing an example of a structure ofthe display panel of FIG. 1;

FIG. 7 is a top plan view showing a panel structure which has a waterinvasion preventing groove at a basic main body section of the displaypanel of FIG. 1;

FIG. 8 is a top plan view showing another panel structure which has awater invasion preventing groove at a basic main body portion and asubstrate end portion of the display panel of FIG. 1;

FIG. 9 is a block diagram showing a general configuration of an organicEL display apparatus to which the display apparatus according to theembodiment of the disclosed technology is applied;

FIG. 10 is a circuit diagram showing an example of a circuitconfiguration of each pixel of the organic EL display apparatus of FIG.9;

FIG. 11 is a timing waveform diagram illustrating basic circuitoperation of the organic EL display apparatus of FIG. 9;

FIGS. 12A to 12D and 13A to 13D are circuit diagrams illustrating basiccircuit operation of the organic EL display apparatus of FIG. 9;

FIGS. 14A and 14B are characteristic diagrams illustrating a subjectarising from a dispersion in threshold voltage of a driving transistorand another subject arising from a dispersion in mobility of the drivingtransistor, respectively;

FIG. 15A is a block diagram showing an example of a configuration of awriting scanning circuit and FIG. 15B is a circuit diagram showing anexample of a circuit of a shift register which configures the writingscanning circuit;

FIG. 16A is a circuit diagram showing an example of a circuitconfiguration of an inverter circuit configured from a combination ofone-sided channel transistors and capacitance elements and FIG. 16B is awaveform diagram showing waveforms of an input pulse signal and anoutput pulse signal of the inverter circuit;

FIG. 17 is a circuit diagram showing an example of a configuration of asignal outputting circuit;

FIG. 18 is a schematic top plan view showing an example of aconfiguration of electrical connection to the outside of the substratein the case where a scanning circuit section is provided in the panel;

FIG. 19 is a similar view but showing an example of a configuration ofelectrical connection to the outside of the substrate in the case wherethe scanning circuit section is provided outside the panel;

FIG. 20 is a perspective view showing an appearance of a television setto which the display apparatus of the disclosed is applied;

FIGS. 21A and 21B are perspective views showing an appearance of adigital camera, to which the display apparatus of the disclosed isapplied, as viewed from the front side and the rear side, respectively;

FIG. 22 is a perspective view showing an appearance of a notebook typepersonal computer to which the display apparatus of the disclosed isapplied;

FIG. 23 is a perspective view showing an appearance of a video camera towhich the display apparatus of the disclosed is applied; and

FIGS. 24A and 24B are a front elevational view and a side elevationalview, respectively, showing a portable telephone set in an unfoldedstate, and FIGS. 24C, 24D, 24E, 24F and 24G are a front elevationalview, a left side elevational view, a right side elevational view, a topplan view and a bottom plan view, respectively, of the portabletelephone set.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

In the following, a preferred embodiment of the disclosed technology isdescribed in detail with reference to the accompanying drawings. It isto be noted that the description is given in the following order.

1. Embodiment

2. Organic EL Display Apparatus to which the Disclosed Technology IsApplied

2-1. System Configuration

2-2. Basic Circuit Action

2-3. Example of the Configuration of the Driving Circuit Section

3. Modifications

4. Electronic Apparatus

1. Embodiment

FIG. 1 shows a general structure of a display panel of a displayapparatus according to an embodiment of the disclosed technology.Meanwhile, FIGS. 2A and 2B show cross sections of the display panelbefore and after folding thereof, respectively.

Referring to FIGS. 1, 2A and 2B, the display apparatus 10 according tothe embodiment is defined most in that a foldable or bendable substrateis used as a substrate which configures a display panel 70, moreparticularly as a substrate on which pixel circuits are to be formed.For the foldable substrate, a known substrate such as a metal substratewhich is a thin plate of a metal, a plastic substrate or the like can beused.

Preferably, the metal substrate is formed, for example, from a stainlesssteel substrate from a point of view of the corrosion resistance.However, from a point of view of the insulating property, preferably aplastic substrate is used rather than a metal substrate. A thin plate ofa stainless steel substrate, a plastic substrate or the like can befolded or bent readily using a known bending jig.

The display panel 70 includes a substrate main body section 70 _(A), andfour substrate end portions 70 _(B) to 70 _(E) folded to the rear faceside, for example, along the four sides of a periphery of the substratemain body section 70 _(A). In FIG. 1, of the four substrate end portions70 _(B) to 70 _(E), the substrate end portions 70 _(B) and 70 _(C) onthe opposite left and right sides of the substrate main body section 70_(A) and the substrate end portion 70 _(D) on the lower side of thesubstrate main body section 70 _(A) are schematically shown by alternatelong and short dash lines.

A plurality of pixels or pixel circuits 20 each including anelectro-optical element such as, for example, an electro-optical elementof the self luminous type are arrayed two-dimensionally in rows andcolumns over a substantial overall area of the substrate main bodysection 70 _(A) of the display panel 70 to configure a pixel arraysection 30. Here, as the electro-optical element of the self luminoustype, an organic EL element, an inorganic EL element, an LED element, asemiconductor laser element and so forth are widely known. Theelectro-optical elements of the self luminous type are light emittingelements of the current driven type whose emitted light luminance variesin response to the value of current flowing therethrough.

Meanwhile, on the substrate end portions 70 _(B) and 70 _(C) on theopposite left and right sides and the substrate end portion 70 _(B) onthe lower side of the substrate main body section 70 _(A), peripheralcircuit sections 80 _(A) to 80 _(C) for driving the pixels 20 of thepixel array section 30 are provided. The peripheral circuit sections 80_(A) to 80 _(C) are electrically connected to the pixel array section 30through wiring lines of a wiring line section 81 as seen in FIGS. 2A and2B. A particular example of the peripheral circuit sections 80 _(A) to80 _(C) is hereinafter described.

Upon fabrication of the display panel 70, the pixels 20 of the pixelarray section 30 are formed and circuit elements of the peripheralcircuit sections 80 _(A) to 80 _(C) are formed on the bendable orfoldable substrate (70 _(A) to 70 _(B)) in the form of a flat plate asshown in FIG. 2A. Further, wiring lines of the wiring line section 81for electrically connecting the pixel array section 30 and theperipheral circuit sections 80 _(A) to 80 _(C) to each other are formedor wired.

For the display panel 70 in the form of a flat plate on which the pixelarray section 30, peripheral circuit sections 80 _(A) to 80 _(C) andwiring line section 81 are formed in this manner, a bending or foldingwork is carried out, for example, from a start point at which a foldingjig 82 is disposed on the rear face of the wiring line section 81 asseen in FIG. 2A. By this folding work, the substrate end portions 70_(B) and 70 _(C) (70 _(B)) on which the peripheral circuit sections 80_(A) and 80 _(B) (80 _(C)) are mounted are folded and positioned on therear side of the substrate main body section 70 _(A), that is, on theopposite side to the display face.

Accordingly, as a molding of a framework on a periphery of the pixelarray section 30 of the display panel 70, only part of the wiring linesection 81 exists, and therefore, the framework molding of the displaypanel 70 can be formed narrow or with a small width. In other words, thearea of a surplus region which does not contribute to image displayaround the pixel array section 30 can be suppressed to a minimumnecessary degree.

Besides, the pixel array section 30 and the peripheral circuit sections80 _(A) to 80 _(C) are electrically connected to the wiring lines of thewiring line section 81 formed on one substrate although the substrate isfolded between them. Consequently, there is no necessity to provide padportions such as terminals which are provided in a case wherein aflexible cable or the like is used to connect an external substrate, forexample, to the substrate main body section 70 _(A). Accordingly, sincethere is no necessity to assure a region for providing pad portions,further reduction in width of the framework molding of the display panel70 can be anticipated.

Further, the substrate end portions 70 _(B) and 70 _(C) (70 _(D)) arenot restricted in size if the size remains within a range of the size ofthe substrate main body section 70 _(A) on which the pixel array section30 is provided. Accordingly, the circuit scale of the peripheral circuitsections 80 _(A) and 80 _(B) (80 _(C)) disposed on the substrate endportions 70 _(B) and 70 _(C) (70 _(D)) and hence the function of theperipheral circuit sections 80 _(A) and 80 _(B) (80 _(C)) are notrestricted.

In the present embodiment, the display panel 70 is folded on the foursides thereof on the periphery of the pixel array section 30, and theperipheral circuit sections 80 _(A), 80 _(B) and 80 _(C) are mounted onthe three substrate end portions 70 _(B), 70 _(C) and 70 _(D) from thefour sides. However, the panel structure of the display panel 70 is notlimited to this. For example, on three sides of the periphery of thepixel array section 30 on which the peripheral circuit sections 80 _(A),80 _(B) and 80 _(C) are mounted may be bent or folded as seen in FIG. 3.In this instance, since the substrate end portion 70 _(E) which remainsnot bent or folded forms a margin which occupies most part of theframework, it is considered preferable to bend or fold the display panel70 on the four sides. Further, even if four or three sides are notfolded but at least one side of the periphery of the pixel array section30 is folded, then the effect of reduction of the width of the frameworkmolding in comparison with that in an alternative case wherein none ofthe four sides is folded.

As described above, as a substrate which configures the display panel70, a foldable substrate is used. Then, by disposing the peripheralcircuit sections 80 _(A), 80 _(B) and 80 _(C) on the substrate endportions 70 _(B), 70 _(C) and 70 _(D) folded on at least one side of theperiphery of the pixel array section 30, various circuits having variousfunctions can be mounted as the peripheral circuit sections 80 _(A), 80_(B) and 80 _(C) without being restricted by the framework molding size.Accordingly, further reduction of the width of the framework molding ofthe display panel 70 can be achieved without limiting the functions ofthe peripheral circuit sections 80 _(A), 80 _(B) and 80 _(C).Particularly if the pixel array section 30 is folded on the four sidesof the periphery thereof, a display apparatus which substantiallyeliminates the framework mounting portion and uses the overall area ofthe display face of the display panel 70 as a display area can beimplemented.

FIGS. 4A and 4B show the display panel 70 before and after the substrateend portions 70 _(B), 70 _(C) and 70 _(D) are folded, respectively. Inthe example of FIGS. 4A and 4B, from among the four sides of theperiphery of the pixel array section 30, only three sides of theperiphery of the pixel array section 30 on which the peripheral circuitsections 80 _(A), 80 _(B) and 80 _(C) are mounted are folded while theremaining one side, which is shown on the upper side in FIGS. 4A and 4B,is cut away.

In FIGS. 4A and 4B, the pixel array section 30 is a valid pixel sectionwhich contributes to display of an image, that is, a display areasection. The substrate end portions 70 _(B) and 70 _(C) on the oppositeleft and right sides of the pixel array section 30, that is, on the leftand right sides of the substrate main body section 70 _(A), and thesubstrate end portion 70 _(D) on the lower side are folded while thesubstrate end portion 70 _(D) on the upper side is cut off. Details aredescribed below.

First, in order to cut away the substrate end portion 70 _(E) on theupper side, a cutting portion 83 _(A) is formed between the upper end ofthe substrate main body section 70 _(A) and the substrate end portion 70_(E) such that it extends in a horizontal direction between the oppositeends of the substrate main body section 70 _(A). Then, grooves 83 _(B)and 83 _(D) are formed between the opposite ends of the cutting portion83 _(A) and the upper end of the substrate end portion 70 _(E).Consequently, the substrate end portion 70 _(E) on the upper side can becut away from the substrate main body section 70 _(A).

Then, in order to fold the substrate end portions 70 _(B) and 70 _(C) onthe opposite left and right sides, grooves 83 _(D) and 83 _(E) areformed on the substrate end portions 70 _(B) and 70 _(C) such that theyextend along the lower end of the substrate main body section 70 _(A)from the opposite left and right sides. Then, before the substrate endportions 70 _(B) and 70 _(C) are bent, upper end portions 70 _(B0) and70 _(C0) of them are bent along thick broken lines. Thereafter, thesubstrate end portions 70 _(B) and 70 _(C) are bent along the thickbroken lines, and the substrate end portions 70 _(B) and 70 _(C) arebent along the thick broken lines on the boundaries between thesubstrate end portions 70 _(B) and 70 _(C) and the substrate main bodysection 70 _(A).

Then, for example, at an upper end of the upper end portions 70 _(B0)and 70 _(C0) of the substrate end portions 70 _(B) and 70 _(C), theperipheral circuit sections 80 _(A) and 80 _(B) and the outside of thesubstrate are electrically connected to each other. In particular, padportions 84 _(A) and 84 _(B) for fetching a power supply voltage forperipheral circuit sections 80 _(A) and 80 _(B) and various signals fromthe outside of the substrate therethrough are provided. The pad portions84 _(A) and 84 _(B) are provided on the substrate end portions 70 _(B)and 70 _(C) on which the peripheral circuit sections 80 _(A) and 80 _(B)are provided, respectively, more particularly at locations, that is, atthe upper end portions 70 _(B0) and 70 _(C0), in the substrate endportions 70 _(B) and 70 _(C) farther than the bent portions. The padportions 84 _(A) and 84 _(B) and the peripheral circuit sections 80 _(A)and 80 _(B) are electrically connected to each other through wiringlines on the bent portions in the substrate end portions 70 _(B) and 70_(C).

Thereafter, in order to bend the substrate end portion 70 _(D), theopposite end portions 70 _(D1) and 70 _(D2) of the substrate end portion70 _(D) are first bent along thick broken lines on extension lines ofbending lines of the substrate end portions 70 _(B) and 70 _(C) on theboundaries of the grooves 83 _(D) and 83 _(E). Then, the substrate endportion 70 _(D) is bent along a thick broken line on the boundarybetween the substrate end portion 70 _(D) and the substrate main bodysection 70 _(A), that is, along a thick broken line interconnecting thegrooves 83 _(D) and 83 _(E).

Here, it is assumed that, as an example, the peripheral circuit section80 _(C) mounted on the substrate end portion 70 _(D) is a signaloutputting circuit which outputs a video signal supplied from a signalsupply source not shown provided externally of the substrate ashereinafter described to the pixels of the pixel array section 30. Inthis instance, the pad portion group 84 _(C) for fetching a video signalfrom the outside of the substrate is provided for each pixel column ofthe pixel array section 30 at a lower end of the substrate end portion70 _(D). The pad portion group 84 _(C) is provided substantiallycorresponding to the pixel columns of the pixel array section 30 overthe width of the pixel array section 30 in the horizontal direction.

A pair of pad portions 84 _(D) and 84 _(E) for electrically connectingthe peripheral circuit section 80 _(C) and the outside of the substrateto each other, that is, for fetching gate controlling signals forcontrolling, for example, transistors which configure the signaloutputting circuit described above from the outside of the substrate,are provided, for example, at a lower end of the opposite end portions70 _(D1) and 70 _(D2) of the substrate end portion 70 _(D),respectively. In particular, the pad portions 84 _(D) and 84 _(E) areprovided on the substrate end portion 70 _(D) on which the signaloutputting circuit formed from the peripheral circuit section 80 _(C) isprovided, more particularly at locations, that is, at the opposite endportions 70 _(D1) and 70 _(D2), in the substrate end portion 70 _(D)farther than the bent portions. Then, the pad portions 84 _(D) and 84_(E) and the peripheral circuit section 80 _(C) are electricallyconnected to each other by wiring lines on the bent portions in thesubstrate end portion 70 _(D).

As described hereinabove, by cutting away the substrate end portion 70_(E) on the upper side from the substrate main body section 70 _(A) andthen bending the substrate end portions 70 _(B) and 70 _(C) on theopposite left and right sides and the substrate end portion 70 _(D) onthe lower side, the display panel 70 substantially of a size of thesubstrate main body section 70 _(A) can be implemented. However, sinceit is necessary to assure a bending margin at the bent portions of thesubstrate end portions 70 _(B), 70 _(C) and 70 _(D), the final displaypanel 70 has some framework molding 70 _(F) on the periphery of thesubstrate main body section 70 _(A) as seen in FIG. 4B.

Further, by disposing the peripheral circuit sections 80 _(A), 80 _(B)and 80 _(C) on the folded substrate end portions 70 _(B), 70 _(C) and 70_(D), circuits having various functions can be incorporated as theperipheral circuit sections 80 _(A), 80 _(B) and 80 _(C) without beingrestricted by the framework molding size. Accordingly, further reductionin width of the framework molding of the display panel 70 can beachieved without limiting the functions of the peripheral circuitsections 80 _(A), 80 _(B) and 80 _(C).

Besides, pad portions 84 _(A), 84 _(B), 84 _(D) and 84 _(E) forelectrically connecting the peripheral circuit sections 80 _(A), 80 _(B)and 80 _(C) and the outside of the substrate to each other are providedon the substrate end portions 70 _(B), 70 _(C) and 70 _(D) on which theperipheral circuit sections 80 _(A), 80 _(B) and 80 _(C) are provided,respectively. More particularly, the pad portions 84 _(A), 84 _(B), 84_(D) and 84 _(E) are provided at locations on the substrate end portions70 _(B), 70 _(C) and 70 _(D) farther than the bend portions in thesubstrate end portions 70 _(B), 70 _(C) and 70 _(D), that is, at theupper end portions 70 _(B0) and 70 _(C0) and the opposite end portions70 _(D1) and 70 _(D2) of the substrate end portions 70 _(B), 70 _(C) and70 _(D). Consequently, the distance between the bent portions in thesubstrate end portions 70 _(B), 70 _(C) and 70 _(D) and the peripheralcircuit sections 80 _(A), 80 _(B) and 80 _(C) is small, and even ifwiring lines cannot be laid, electric connection between the peripheralcircuit sections 80 _(A), 80 _(B) and 80 _(C) and the outside of thesubstrate can be established with certainty.

Here, an example of a procedure of bending or folding of the substrateend portions 70 _(B), 70 _(C) and 70 _(D) of the substrate having thestructure described above is described with reference to FIGS. 5A to 5D.FIG. 5A corresponds to FIG. 4A.

In the state illustrated in FIG. 5A, the substrate end portion 70 _(E)on the upper side is cut away from the substrate main body section 70_(A). Then, the upper end portions 70 _(B0) and 70 _(C0) of thesubstrate end portions 70 _(B) and 70 _(C) on the opposite left andright sides are folded to the rear face side of the substrate endportions 70 _(B) and 70 _(C) as indicated by arrow marks in FIG. 5B.Further, the opposite end portions 70 _(D1) and 70 _(D2) of thesubstrate end portion 70 _(D) on the lower side is folded to the rearface side of the substrate end portion 70 _(D) as indicated by arrowmarks.

Then, the substrate end portions 70 _(B) and 70 _(C) on the oppositeleft and right sides are folded to the rear face side of the substratemain body section 70 _(A) as indicated by arrow marks, and then thesubstrate end portion 70 _(D) on the lower side is bent or folded to therear face side of the substrate main body section 70 _(A) as indicatedby arrow marks. Consequently, the display panel 70 having some frameworkmolding 70 _(F) on the periphery of the substrate main body section 70_(A) as seen in FIG. 5D is formed. FIG. 5D corresponds to FIG. 4B.

Now, a structure of the display panel 70 is described with reference toFIG. 6. FIG. 6 shows a partial section of an example of the structure ofthe display panel 70.

As described hereinabove, the display panel 70 includes the substratemain body section 70 _(A) on which the pixel array section 30 is formed,the substrate end portion 70 _(B) (70 _(C)) on which the peripheralcircuit section 80 _(A) (80 _(B)) is formed, and a folding or bendingregion 85 positioned between the substrate main body section 70 _(A) andthe substrate end portion 70 _(B) (70 _(C)) as seen in FIG. 2. Thewiring line section 81 for electrically connecting the peripheralcircuit section 80 _(A) (80 _(B)) and the pixel array section 30 to eachother is formed in the folding region 85. In other words, on the wiringline section 81 of the folding region 85, only simple metal wiring linesare laid out while any circuit section including a transistor or thelike is not laid out.

In FIG. 6, a circuit section including thin film transistors (TFTs) 22including a gate electrode 221 and so forth is formed on a foldablesubstrate 201. Further, an insulating film, that is, a gate insulatingfilm 202, a flattening film 203 and a window insulating film 204 arelaminated in this order on the substrate 201. Further, as anelectro-optical element, for example, an organic EL element 21 is formedin a recessed portion of the window insulating film 204. The TFTs 22are, for example, driving transistors for driving such organic ELelements 21.

Each organic EL element 21 includes an anode electrode 205, an organiclayer 206, and a cathode electrode 207. The anode electrode 205 is madeof a metal formed on the bottom of the recessed portion of the windowinsulating film 204. The organic layer 206 is formed on the anodeelectrode 205. The cathode electrode 207 is formed from a transparentconductor film or the like formed commonly to all pixels on the organiclayer 206.

In the organic EL element 21, the organic layer 206 is formed from ahole transport layer/hole implantation layer, a light emitting layer, anelectron transport layer and an electron implantation layer successivelydeposited on the anode electrode 205. Then, under current driving by theTFT 22, current flows from the TFT 22 to the organic layer 206 throughthe anode electrode 205, whereupon electrons and holes are recombined inthe light emitting layer in the organic layer 206 to emit light.

The pixel section including the organic EL elements 21 and the TFTs 22is protected by a protective layer 208 from above. The substrate 201 iscovered over an overall area thereof with a sheet resin 209. Further,above the sheet resin 209 on the substrate main body section 70 _(A) onwhich the pixel array section 30 is formed, an opposing substrate 209which is a second substrate formed from a sealing film, a glasssubstrate or the like is disposed. In other words, the opposingsubstrate 210 is disposed only in a region of the substrate main bodysection 70 _(A) so as not to extend to the folding region 85.

As apparently seen from FIG. 6, only metal wiring lines 811 are laid outin the wiring line section 81 of the folding region 85 while a circuitsection including a transistor or like is not laid out. In particular,the folding region 85 is configured such that the metal wiring lines 811are formed on the substrate 201 with the insulating film 202 interposedtherebetween and the flattening film 203 and the window insulating film204 are laminated in order on the metal wiring lines 811 and are coveredwith the sheet resin 209 from above.

Incidentally, the display panel 70 of the panel structure describedabove sometimes suffers from crazing or cracking when the display panel70 is folded at the folding region 85. If cracking occurs, then water orthe like may invade into the display panel 70 through the crack and maypossibly deteriorate a circuit element of the pixel array section 30.

Therefore, in order to prevent such invasion of water or the likethrough the crack thereby to prevent deterioration of the circuitelements, the display panel 70 in the present embodiment has a panelstructure wherein a water invasion preventing groove 86 is provided onthe substrate 201 on the pixel array section 30 side with respect to thefolding region 85. The water invasion preventing groove 86 is formedsuch that it surrounds the pixel array section 30 as seen in a plan viewof FIG. 7. The water invasion preventing groove 86 is formed by removingthe flattening film 203 and the window insulating film 204 as apparentlyseen from the sectional view of FIG. 6.

By adopting the panel structure in which the water invasion preventinggroove 86 is provided in this manner, even if a crack appears when thedisplay panel 70 is folded, water or the like invading from the crack isaccumulated in the water invasion preventing groove 86 and is preventedfrom further invading to the pixel array section 30 side by the waterinvasion preventing groove 86. Accordingly, deterioration of the circuitelements which may arise from water or the like invading through thecrack can be prevented, and consequently, electric reliability of thedisplay panel 70 is not damaged. In other words, while electricreliability of the display panel 70 is maintained, reduction in width ofthe framework molding of the display panel 70 by folding of thesubstrate can be anticipated.

It is to be noted that, while it is described above that the waterinvasion preventing groove 86 is formed on the substrate 201 on thepixel array section 30 side with respect to the folding region 85 insuch a manner as to surround the pixel array section 30, the waterinvasion preventing groove 86 need not necessarily be formed on thedisplay panel 70 side. In particular, in addition to a water invasionpreventing groove 86 _(A) on the pixel array section 30, a waterinvasion preventing groove 86 may be formed at least one of thesubstrate end portions 70 _(B), 70 _(C) and 70 _(D) as seen in FIG. 8.

In particular, referring to FIG. 8, water invasion preventing groove 86_(B), 86 _(C) and 86 _(D) may be formed on the substrate end portions 70_(B), 70 _(C) and 70 _(D) on the peripheral circuit sections 80 _(A), 80_(B) and 80 _(C) side with respect to the folding region 85 in such amanner as to surround the peripheral circuit sections 80 _(A), 80 _(B)and 80 _(C), respectively. Although it is shown in FIG. 8 that the waterinvasion preventing groove 86 (86 _(B), 86 _(C) and 86 _(D)) is formedon all of the substrate end portions 70 _(B), 70 _(C) and 70 _(D), itmay otherwise be formed on only one of the substrate end portions 70_(B), 70 _(C) and 70 _(D).

By forming the water invasion preventing groove 86 also on the substrateend portions 70 _(B), 70 _(C) and 70 _(D) side in this manner, even if acrack appears on the substrate end portions 70 _(B), 70 _(C) and 70 _(D)when the display panel 70 is folded, a working effect similar to that ofthe substrate main body section 70 _(A) can be achieved. In particular,water or the like invading from the crack is accumulated in the waterinvasion preventing grooves 86 _(B), 86 _(C) and 86 _(D) and isprevented from further invading toward the peripheral circuit sections80 _(A), 80 _(B) and 80 _(C) side by the water invasion preventinggrooves 86 _(B), 86 _(C) and 86 _(D). Accordingly, otherwise possibledeterioration of the circuit elements of the peripheral circuit sections80 _(A), 80 _(B) and 80 _(C) arising from water or the like invadingthrough the crack can be prevented, and therefore, electric reliabilityof the display panel 70 is not damaged. In other words, while electricreliability of the display panel 70 is further maintained, reduction inwidth of the framework molding of framework of the display panel 70 byfolding of the substrate can be achieved.

2. Organic EL Display Apparatus to which the Disclosed Technology isApplied

The display apparatus in which a display panel can be configured byusing a foldable or bendable substrate includes a display apparatus of aflat panel type using an electro-optical element of the self luminoustype as the electro-optical element of the pixels 20. An organic ELdisplay apparatus making use of an organic EL element as anelectro-optical element is described below.

2-1. System Configuration

FIG. 9 shows a general configuration of an active matrix type organic ELdisplay apparatus to which the disclosed technology is applied.

Referring to FIG. 9, the organic EL display apparatus 10 _(A) accordingto the present application includes a pixel array section 30 in which aplurality of pixels 20 each including an organic EL element are arrayedtwo-dimensionally in rows and columns, and peripheral circuit sectionsdisposed around the pixel array section 30. The peripheral circuitsections include a writing scanning circuit 40, a power supply scanningcircuit 50, a signal outputting circuit 60 and so forth and drive thepixels 20 of the pixel array section 30.

If the organic EL display apparatus 10 _(A) is ready for color display,then one pixel is configured from a plurality of subpixels, and each ofthe subpixels corresponds to a pixel 20. More particularly, in a displayapparatus for color display, one pixel is configured from three subpixels including a subpixel for emitting red light (R), another subpixelfor emitting green light (G) and a further subpixel for emitting bluelight (B).

However, one pixel is not limited to a combination of subpixels of thethree primary colors of red, green and blue but may be configured fromone subpixel of a color or a plurality of subpixels of different colorsin addition to subpixels of the three primary colors. More particularly,in order to improve the luminance, a subpixel for emitting white light(W) may be additionally used to configure one pixel or at least onesubpixel for emitting complementary color light for enlarging the colorreproduction range may be additionally used to configure one pixel.

The pixel array section 30 corresponds to the pixel array section 30described hereinabove in connection with the embodiment of the disclosedtechnology and is formed on a foldable substrate (201), that is, on thesubstrate main body section 70 _(A) of the embodiment describedhereinabove. The pixel array section 30 includes scanning lines 31 ₁ to51 _(m), power supply lines 32 ₁ to 32 _(m), and signal lines 33 ₁ to 33_(n). The scanning lines 31 ₁ to 31 _(m) and the power supply lines 32 ₁to 32 _(m) are wired for the individual pixel rows along a rowdirection, that is, along a direction in which the pixels are arrayed ina pixel row, for the array of the pixels 20 arrayed in m rows and ncolumns. The signal lines 33 ₁ to 33 _(n) are wired for the individualpixel columns along a column direction, that is, in a direction in whichthe pixels are arrayed in a pixel column.

The scanning lines 31 ₁ to 31 _(m), power supply lines 32 ₁ to 32 _(m)and signal lines 33 ₁ to 33 _(n) correspond to wiring lines of thewiring line section 81 in the embodiment described hereinabove. Further,the writing scanning circuit 40, power supply scanning circuit 50 andsignal outputting circuit 60 correspond to the peripheral circuitsections 80 _(A), 80 _(B) and 80 _(C) in the embodiment describedhereinabove, respectively.

The scanning lines 31 ₁ to 31 _(m) are connected to output terminals ofcorresponding rows of the writing scanning circuit 40. The power supplylines 32 ₁ to 32 _(m) are connected to output terminals of correspondingrows of the power supply scanning circuit 50. The signal lines 33 ₁ to33 _(n) are connected to output terminals of corresponding columns ofthe signal outputting circuit 60.

The writing scanning circuit 40 is configured from a shift registerwhich shifts or transfers a start pulse sp in response to a clock pulseck or from a like circuit. A detailed configuration of the writingscanning circuit 40 is hereinafter described. Upon writing of a videosignal into the pixels 20 of the pixel array section 30, the writingscanning circuit 40 successively supplies writing scanning signals WS(WS₁ to WS_(n)) to the scanning lines 31 (31 ₁ to 31 _(m)) tosuccessively scan the pixels 20 of the pixel array section 30 in a unitof a row (line-sequential scanning).

The power supply scanning circuit 50 is configured from a shift registerwhich shifts a start pulse sp in response to the clock pulse ck or alike circuit. The power supply scanning circuit 50 supplies power supplypotentials DS (DS₁ to DS_(m)), which can change over between a firstpower supply potential V_(ccp) and a second power supply potentialV_(ini) which is lower than the first power supply potential V_(ccp), tothe power supply lines 32 (32 ₁ to 32 _(m)) in synchronism withline-sequential scanning by the writing scanning circuit 40. Ashereinafter described, light emission/no-light emission control of thepixels 20 is carried out by changeover of the power supply potential DSbetween the first power supply potential V_(ccp) and the second powersupply potential V_(ini) as hereinafter described.

The signal outputting circuit 60 selectively outputs a signal voltageV_(sig) of a video signal corresponding to luminance informationsupplied thereto from a signal supplying source not shown and areference potential V_(ofs). Here, the reference potential V_(ofs) is apotential which makes a reference to the signal voltage V_(sig) of thevideo signal such as, for example, a potential corresponding to theblack level of the video signal, and is used upon a threshold valuecorrection process hereinafter described.

The signal voltage V_(sig)/reference potential V_(ofs) outputted fromthe signal outputting circuit 60 is written into the pixels 20 of thepixel array section 30 through the signal lines 33 (33 ₁ to 33 _(n)) ina unit of a pixel row selected by scanning by the writing scanningcircuit 40. In particular, the signal outputting circuit 60 adopts adriving form for line-sequential scanning of writing the signal voltageV_(sig) in a unit of a row or line.

As described hereinabove, the display panel 70 on which the pixel arraysection 30, writing scanning circuit 40, power supply scanning circuit50 and signal outputting circuit 60 are mounted is formed from afoldable substrate and is folded at portions thereof indicated byalternate long and short dash lines on the periphery of the pixel arraysection 30. Consequently, reduction of the width of the frame molding ofthe display panel 70 can be achieved without restricting the functionsof the writing scanning circuit 40, power supply scanning circuit 50 andsignal outputting circuit 60. The functions of the writing scanningcircuit 40, power supply scanning circuit 50 and signal outputtingcircuit 60 are hereinafter described.

Pixel Circuit

FIG. 10 shows an example of a particular circuit configuration of eachpixel or pixel circuit 20. A light emitting section of the pixel 20 isformed from an organic EL element 21 which is an electro-optical elementof the current driven type which emits light whose luminance varies inresponse to the value of current flowing therethrough.

Referring to FIG. 10, the pixel 20 is configured from an organic ELelement 21, and a driving circuit for supplying current to the organicEL element 21 to drive the organic EL element 21. The organic EL element21 is connected at the cathode electrode thereof to a common powersupply line 34 wired commonly to all pixels 20.

The driving circuit for driving the organic EL element 21 includes adriving transistor 22, a writing transistor 23, a retaining capacitor24, and an auxiliary capacitor 25. A TFT of the N channel type can beused for the driving transistor 22 and the writing transistor 23.However, the combination of the conduction types of the drivingtransistor 22 and the writing transistor 23 described here is a mereexample, and the combination of conduction types of the drivingtransistor 22 and the writing transistor 23 is not limited to thisspecific one.

The driving transistor 22 is connected at one electrode thereof, thatis, at one of the source and drain electrodes thereof, to the anodeelectrode of the organic EL element 21, and at the other electrodethereof, that is, at the drain or source electrode thereof, to a powersupply line 32 (32 ₁ to 32 _(m)).

The writing transistor 23 is connected at one electrode thereof, thatis, at one of the source and drain electrodes thereof, to a signal line33 (33 ₁ to 33 _(n)) and at the other electrode thereof, that is, at thedrain or source electrode thereof, to the gate electrode of the drivingtransistor 22. Further, the writing transistor 23 is connected at thegate electrode thereof to a scanning line 31 (31 ₁ to 31 _(m)).

The one of the electrodes of the driving transistor 22 and the writingtransistor 23 is a metal wiring line electrically connected to thesource/drain region, and the other electrode is a metal wiring lineelectrically connected to the drain/source region. Further, the oneelectrode may serve as the source electrode or the drain electrode andthe other electrode may serve as the drain electrode and the sourceelectrode depending upon the potential relationship between the oneelectrode and the other electrode.

The retaining capacitor 24 is connected at one electrode thereof to thegate electrode of the driving transistor 22 and at the other electrodethereof to the other electrode of the driving transistor 22 and theanode electrode of the organic EL element 21.

The auxiliary capacitor 25 is connected at one electrode thereof to theanode electrode of the organic EL element 21 and at the other electrodethereof to the common power supply line 34. The auxiliary capacitor 25is provided as occasion demands in order to compensate for shortage ofthe capacitance of the organic EL element 21 and raise the write gain ofa video signal into the retaining capacitor 24. In other words, theauxiliary capacitor 25 is not an essentially required component and canbe omitted in the case where the equivalent capacitance of the organicEL element 21 is sufficiently high.

While the other electrode of the auxiliary capacitor 25 here isconnected to the common power supply line 34, the connection destinationof the other electrode of the auxiliary capacitor 25 is not limited tothe common power supply line 34 but may be a node of a fixed potential.By connecting the other electrode of the auxiliary capacitor 25 to thenode of a fixed potential, it is possible to compensate for shortage ofthe capacitance of the organic EL element 21 and achieve the intendedaim of raising the write gain of a video signal into the retainingcapacitor 24.

In the pixel 20 of the configuration described above, the writingtransistor 23 is placed into a conducting state in response to aHigh-active writing scanning signal WS applied to the gate electrodethereof from the writing scanning circuit 40 through the scanning line31. Consequently, the writing transistor 23 samples the signal voltageV_(sig) or the reference potential V_(ofs) of the video signalcorresponding to luminance information supplied thereto from the signaloutputting circuit 60 through the signal line 33 and writes the sampledvoltage into a pixel 20. The signal voltage V_(sig) or referencepotential V_(ofs) thus written in is applied to the gate electrode ofthe driving transistor 22 and retained into the retaining capacitor 24.

When the power supply potential DS of the power supply line 32 (32 ₁ to32 _(m)) is the first power supply potential V_(ccp), the drivingtransistor 22 operates in a saturation region while the one electrode ofthe driving transistor 22 serves as the drain electrode and the otherelectrode of the driving transistor 22 serves as the source electrode.Consequently, the driving transistor 22 receives supply of current fromthe power supply line 32 and drives the organic EL element 21 by currentdriving to emit light. More particularly, the driving transistor 22operates in a saturation region such that it supplies driving current ofa current value corresponding to the voltage value of the signal voltageV_(sig) retained in the retaining capacitor 24 to the organic EL element21 such that the organic EL element 21 is driven by current driving toemit light.

On the other hand, if the power supply potential DS changes over fromthe first power supply potential V_(ccp) to the second power supplypotential V_(ini), then the driving transistor 22 operates as aswitching transistor while the one electrode serves as the sourceelectrode and the other electrode serves as the drain electrode. Then,the driving transistor 22 is placed into a non-conducting state to stopthe supply of driving current to the organic EL element 21 thereto toplace the organic EL element 21 into a no-light emitting state. In otherwords, the driving transistor 22 has also a function as a transistor forcontrolling light emission/no-light emission of the organic EL element21.

By this switching operation of the driving transistor 22, it is possibleto provide a period within which the organic EL element 21 is in ano-light emitting state, that is, in a no-light emitting period andcontrol the rate between the light emitting period and the no-lightemitting period of the organic EL element 21, that is, the duty of theorganic EL element 21. By this duty control, remaining image blurringcaused by emission of light by a pixel over one display frame period canbe reduced, and consequently, the picture quality of a moving picturecan be further improved.

Of the first and second power supply potentials V_(ccp) and V_(ini)supplied selectively from the power supply scanning circuit 50 throughthe power supply line 32, the first power supply potential V_(ccp) is apower supply potential for supplying driving current for driving theorganic EL element 21 to emit light to the driving transistor 22.Meanwhile, the second power supply potential V_(ini) is another powersupply potential for applying a reverse bias to the organic EL element21. This second power supply potential V_(ini) is set to a potentiallower than the reference potential V_(ofs), for example, where athreshold voltage of the driving transistor 22 is represented by V_(th),to a potential lower than V_(ofs)−V_(th), preferably to a potentialsufficiently lower than V_(ofs)−V_(th).

2-2. Basic Circuit Action

Now, basic circuit action of the display apparatus 10 having theconfiguration described above is described with reference to FIGS. 11 to13D. It is to be noted that, in FIGS. 12A to 13D, the writing transistor23 is indicated by a symbol of a switch for simplified illustration.

In FIG. 11, variations of the potential DS, that is, the write scanningsignal WS, of a scanning line 31, the potential DS, that is, the powersupply potential, of a power supply line 32, the potential(V_(sig)/V_(ofs)) of a signal line 33, and the gate potential V_(g) andthe source potential V_(s) of the driving transistor 22 are illustrated.Further, the waveform of the gate potential V_(g) of the drivingtransistor 22 is indicated by an alternate long and short dash linewhile the waveform of the source potential V_(s) is indicated by abroken line so that they can be distinguished from each other.

Light Emitting Period of a Pre-Display Frame

In FIG. 11, a period before time t₁₁ is a light emitting period of theorganic EL element 21 in a preceding display frame. Within the lightemitting period of the pre-display frame, the power supply potential DSof the power supply line 32 exhibits a first power supply potential(hereinafter referred to as “high potential”) V_(ccp) while the writingtransistor 23 is in a non-conducting state.

The driving transistor 22 is designed such that, at this time, itoperates in a saturation region. Consequently, driving current ordrain-source current I_(ds) corresponding to the gate-source voltageV_(gs) of the driving transistor 22 is supplied from the power supplyline 32 to the organic EL element 21 through the driving transistor 22as seen in FIG. 12A. Consequently, the organic EL element 21 emits lightwith a luminance corresponding to the current value of the drivingcurrent I_(ds).

Threshold Value Correction Preparation Period

When time t₁₁ comes, a new display frame (current display frame) ofline-sequential scanning is entered. Then, the power supply potential DSof the power supply line 32 changes over from the high potential V_(ccp)to the second power supply potential V_(ini) (hereinafter referred to as“low potential”), which is sufficiently lower than V_(ofs)−V_(th) fromthe reference potential V_(ofs) of the signal line 33 as seen in FIG.12B.

Here, the threshold voltage of the organic EL element 21 is representedby V_(thel), and the potential, that is, the cathode potential, of thecommon power supply line 34 is represented by V_(cath). At this time, ifthe low potential V_(ini) satisfies V_(ini)<V_(thel)+V_(cath), thensince the source potential V_(s) of the driving transistor 22 becomessubstantially equal to the low potential V_(ini), the organic EL element21 is placed into a reversely biased state and turned off.

Then, since the writing scanning signal WS of the scanning line 31transits from the low potential side to the high potential side at timet₁₂, the writing transistor 23 is placed into a conducting state as seenin FIG. 12C. At this time, since the reference potential V_(ofs) issupplied from the signal outputting circuit 60 to the signal line 33,the gate potential V_(g) of the driving transistor 22 becomes thereference potential V_(ofs). Further, the source potential V_(s) of thedriving transistor 22 is the V_(ini) sufficiently lower than thereference potential V_(ofs).

At this time, the gate-source voltage V_(gs) of the driving transistor22 becomes V_(ofs)−V_(ini). Here, if V_(ofs)−V_(ini) is not higher thanthe threshold voltage V_(th) of the driving transistor 22, then since athreshold value correction process hereinafter described cannot becarried out, it is necessary to set V_(ofs)−V_(ini) to a potentialrelationship of V_(ofs)−V_(ini)>V_(th).

A process of fixing the gate potential V_(g) of the driving transistor22 to the reference potential V_(ofs) and fixing the source potentialV_(s) of the driving transistor 22 to the low potential V_(ini) toinitialize them is a preparation process, that is, a threshold valuecorrection preparation process, before a threshold value correctionprocess or threshold value correction operation hereinafter described.Accordingly, the reference potential V_(ofs) and the low potentialV_(ini) are initialization potentials for the gate potential V_(g) andthe source potential V_(s) of the driving transistor 22, respectively.

Threshold Value Correction Period

Then, after the power supply potential DS of the power supply line 32changes over from the low potential V_(ini) to the high potentialV_(ccp) at time t₁₃ as seen in FIG. 12D, a threshold value correctionprocess is started in a state in which the gate potential V_(g) of thedriving transistor 22 is kept at the reference potential V_(ofs). Inparticular, the source potential V_(s) of the driving transistor 22begins its rise toward the potential which is the difference of thethreshold voltage V_(th) from the gate potential V_(g).

Here, for the convenience of description, a process of determining thereference potential V_(ofs) for the gate potential V_(g) of the drivingtransistor 22 as a reference and varying the source potential V_(s)toward the potential which is the difference of the threshold voltageV_(th) from the reference potential V_(ofs) is called threshold valuecorrection process. If this threshold value correction process proceeds,then the gate-source voltage V_(gs) of the driving transistor 22 soonconverges to the threshold voltage V_(th) of the driving transistor 22.This voltage corresponding to the threshold voltage V_(th) is retainedinto the retaining capacitor 24.

It is to be noted that, within a period within which the threshold valuecorrection process is carried out, that is, within a threshold valuecorrection period, in order to allow current to wholly flow toward theretaining capacitor 24 side but prevent current from flowing to theorganic EL element 21 side, the potential V_(cath) of the common powersupply line 34 is set such that the organic EL element 21 is placed intoa cutoff state.

Then, the writing scanning signal WS of the scanning line 31 transits tothe low potential side at time t₁₄, and thereupon, the writingtransistor 23 is placed into non-conducting state as seen in FIG. 13A.At this time, the gate electrode of the driving transistor 22 enters afloating state by being electrically disconnected from the signal line33. However, since the gate-source voltage V_(gs) is equal to thethreshold voltage V_(th) of the driving transistor 22, the drivingtransistor 22 is in a cutoff state. Accordingly, drain-source currentI_(ds) does not flow to the driving transistor 22.

Signal Writing and Mobility Correction Period

Then at time t₁₅, the potential of the signal line 33 changes over fromthe reference potential V_(ofs) to the signal voltage V_(sig) of thevideo signal. Then at time t₁₆, the writing scanning signal WS of thescanning line 31 transits to the high potential side, whereupon thewriting transistor 23 enters a conducting state and samples and writesthe signal voltage V_(sig) of the video signal into the pixel 20.

By the writing of the signal voltage V_(sig) by the writing transistor23, the gate potential V_(g) of the driving transistor 22 becomes thesignal voltage V_(sig). Then, when the driving transistor 22 is drivenby the signal voltage V_(sig) of the video signal, the threshold voltageV_(th) of the driving transistor 22 is canceled by the voltagecorresponding to the threshold voltage V_(th) retained in the retainingcapacitor 24. Details of the principle of the threshold valuecancellation are hereinafter described.

At this time, the organic EL element 21 is in a cutoff state, that is,in a high impedance state. Accordingly, the current which flows from thepower supply line 32 to the driving transistor 22 in response to thesignal voltage V_(sig) of the video signal, that is, the drain-sourcecurrent I_(ds), flows into the equivalent capacitor of the organic ELelement 21 and the auxiliary capacitor 25 thereby to start charging ofthe capacitors.

As the equivalent capacitor of the organic EL element 21 and theauxiliary capacitor 25 are charged, the source potential V_(s) of thedriving transistor 22 gradually rises as time passes. At this time, thedispersion of the threshold voltage V_(th) of the driving transistor 22among the pixels is canceled already, and consequently, the drain-sourcecurrent I_(ds) of the driving transistor 22 relies upon the mobility μof the driving transistor 22. It is to be noted that the mobility μ ofthe driving transistor 22 is a mobility of a semiconductor thin filmwhich configures the channel of the driving transistor 22.

Here, it is assumed that the rate of the retained voltage V_(gs) of theretaining capacitor 24 to the signal voltage V_(sig) of the videosignal, that is, the write gain G, is 1 (ideal value). Thus, if thesource potential V_(s) of the driving transistor 22 rises to thepotential of V_(ofs)−V_(th)+ΔV, then the gate-source voltage V_(gs) ofthe driving transistor 22 becomes V_(sig)−V_(ofs)+V_(th)−ΔV.

In particular, the rise amount ΔV of the source potential V_(s) of thedriving transistor 22 acts so as to be subtracted from the voltageV_(sig)−V_(ofs)+V_(th) retained in the retaining capacitor 24, or inother words, so as to discharge the photocharge of the retainingcapacitor 24, and this signifies that a negative feedback is applied tothe retaining capacitor 24. Accordingly, the rise amount ΔV of thesource potential V_(s) is a feedback amount in negative feedback.

By applying negative feedback to the gate-source voltage V_(gs) by thefeedback amount ΔV corresponding to the drain-source current I_(ds)flowing to the driving transistor 22 in this manner, the dependency ofthe drain-source current I_(ds) of the driving transistor 22 upon themobility μ can be canceled. This cancellation process is a mobilitycorrection process for correcting the dispersion of the mobility μ ofthe driving transistor 22 among the pixels.

More particularly, since the drain-source current I_(ds) increases asthe signal amplitude V_(in) (=V_(sig)−V_(ofs)) of the video signal to bewritten into the gate electrode of the driving transistor 22, also theabsolute value of the feedback amount ΔV in negative feedback increases.Accordingly, the mobility correction process in accordance with theemitted light luminance level is carried out.

Further, if it is assumed that the signal amplitude V_(in) of the videosignal is fixed, then since the absolute value of the feedback amount ΔVincreases as the mobility μ of the driving transistor 22 increases, thedispersion of the mobility μ among the pixels can be removed.Accordingly, the feedback amount ΔV in negative feedback can be regardedalso as a correction amount of the mobility correction process. Detailsof the principle of the mobility correction are hereinafter described.

Light Emitting Period

Then, the writing scanning signal WS of the scanning line 31 transits tothe low potential side at time t₁₇, whereupon the writing transistor 23is placed into a non-conducting state as seen in FIG. 13D. Consequently,the gate electrode of the driving transistor 22 is electricallydisconnected from the signal line 33 and consequently placed into afloating state.

Here, when the gate electrode of the driving transistor 22 is in afloating state, since the retaining capacitor 24 is connected betweenthe gate and the source of the driving transistor 22, also the gatepotential V_(g) varies in an interlocking relationship with thevariation of the source potential V_(s) of the driving transistor 22.The operation wherein the gate potential V_(g) of the driving transistor22 varies in an interlocking relationship with the variation of the gatepotential V_(g) is a bootstrap operation by the retaining capacitor 24.

Then, since the gate electrode of the driving transistor 22 is placedinto a floating state and simultaneously drain-source current I_(ds) ofthe driving transistor 22 begins to flow to the organic EL element 21,the anode potential of the organic EL element 21 rises in response tothe current I_(ds).

Then, if the anode potential of the organic EL element 21 exceedsV_(thel)+V_(cath), then since driving current begins to flow to theorganic EL element 21, the organic EL element 21 begins to emit light.The rise of the anode potential of the organic EL element 21 is no morethan a rise of the source potential V_(s) of the driving transistor 22.Then, as the source potential V_(s) of the driving transistor 22 rises,also the gate potential V_(g) of the driving transistor 22 rises in aninterlocking relationship by a bootstrap operation of the retainingcapacitor 24.

At this time, if it is assumed that the bootstrap gain is 1 (idealvalue), then the rise amount of the gate potential V_(g) is equal to arise amount of the source potential V_(s). Therefore, during a lightemitting period, the gate-source voltage V_(gs) of the drivingtransistor 22 is kept fixed at V_(sig)−V_(ofs)+V_(th)−ΔV. Then, at timet₁₈, the potential of the signal line 33 changes over from the signalvoltage V_(sig) of the video signal to the reference potential V_(ofs).

In the series of circuit operations described above, the processingoperations of threshold value correction preparation, threshold valuecorrection, writing of the signal voltage V_(sig), that is, signalwriting, and mobility correction are executed in one horizontal scanningperiod (1H). Further, the processing operations of signal writing andmobility correction are executed in parallel within the period from t₆to time t₇.

Divisional Threshold Value Correction

It is to be noted here that, while the foregoing description is giventaking a case wherein a driving method wherein a threshold valuecorrection process is executed only once is adopted as an example, thisdriving method is a mere example and the driving method is not limitedto the specific method. For example, in addition to a 1H period withinwhich the threshold value correction process is carried out togetherwith the mobility correction and signal writing processes, the thresholdvalue correction process is executed divisionally by a plural number oftimes over a plurality of horizontal scanning periods executed withinthe 1H period. Thus, also it is possible to adopt a driving method whichinvolves divisional threshold value correction.

With the driving method which involves divisional threshold valuecorrection, even if the period of time allocated as one horizontalscanning period is shortened by increase of the number of pixelsinvolved in enhancement of the definition, sufficient time can beassured over a plurality of horizontal scanning periods for a thresholdvalue correction period. Accordingly, even if the time allocated as onehorizontal scanning period becomes short, the threshold value correctionprocess can be executed with certainty.

Principle of Threshold Value Cancellation

Here, the principle of threshold value cancellation or threshold valuecorrection of the driving transistor 22 is described. Since the drivingtransistor 22 is designed so as to operate in its saturation region, itoperates as a constant current source. Consequently, fixed drain-sourcecurrent or driving current I_(ds) given by the following expression issupplied from the driving transistor 22 to the organic EL element 21:

I _(ds)=(1/2)·μ(W/L)C _(OX)(V _(gs) −V _(th))²   (1)

where W is the channel width of the driving transistor 22, L the channellength and C_(OX) the gate capacitance per unit area.

FIG. 14A illustrates a characteristic of the drain-source current I_(ds)with respect to the gate-source voltage V_(gs) of the driving transistor22. If the cancellation process or correction process for the dispersionof the threshold voltage V_(th) of the driving transistor 22 among thepixels is not carried out as seen from the characteristic diagram ofFIG. 14A, then when the threshold voltage V_(th) is V_(th1), thedrain-source current I_(ds) corresponding to the gate-source voltageV_(gs) becomes I_(ds1).

However, when the threshold voltage V_(th) is V_(th2) (V_(th2)>V_(th1)),the drain-source current I_(ds) corresponding to the same gate-sourcevoltage V_(gs) becomes I_(ds2) (I_(ds2)<I_(ds1)). In particular, if thethreshold voltage V_(th) of the driving transistor 22 varies, then thedrain-source current I_(ds) varies even if the gate-source voltageV_(gs) is fixed.

On the other hand, in the pixel or pixel circuit 20 having theconfiguration described above, the gate-source voltage V_(gs) of thedriving transistor 22 upon light emission is V_(sig)−V_(ofs)+V_(th)−ΔV.Accordingly, if this is substituted into the expression (1), then thedrain-source current I_(ds) is represented by the following expression(2):

I _(ds)=(1/2)·μ(W/L)C _(OX)(V _(sig) −V _(ofs) −ΔV)²   (2)

In particular, the term of the threshold voltage V_(th) of the drivingtransistor 22 is canceled, and the drain-source current I_(ds) suppliedfrom the driving transistor 22 to the organic EL element 21 does notrely upon the threshold voltage V_(th) of the driving transistor 22. Asa result, even if the threshold voltage V_(th) of the driving transistor22 varies among the pixels due to a dispersion in fabrication process, atime-dependent variation and so forth of the driving transistor 22,since the drain-source current I_(ds) does not vary, the emitted lightluminance of the organic EL element 21 can be kept fixed.

Principle of Mobility Correction

Now, the principle of mobility correction of the driving transistor 22is described. FIG. 14B illustrates characteristic curves for comparisonof a pixel A wherein the mobility μ of the driving transistor 22 iscomparatively high and a pixel B wherein the mobility μ of the drivingtransistor 22 is comparatively low. In the case where the drivingtransistor 22 is configured from a polysilicon thin film transistor orthe like, it cannot be avoided that the mobility μ disperses amongpixels like between the pixel A and the pixel B.

For example, a case is considered wherein signal voltages V_(in)(=V_(sig)−V_(ofs)) of an equal level are written into the gateelectrodes of the driving transistors 22 of the pixels A and B while thepixel A and the pixel B have a dispersion in mobility μ therebetween. Inthis instance, if correction of the mobility μ is not carried out, thena great difference appears between the drain-source current I_(ds1)′flowing through the pixel A having the high mobility μ and thedrain-source current I_(ds2)′ flowing through the pixel B having the lowmobility μ. If a great difference appears in drain-source current I_(ds)among the pixels arising from a dispersion in mobility μ among thepixels in this manner, then the uniformity of the screen image isdamaged.

As apparent from the characteristic expression of the expression (1)given hereinabove, as the mobility μ increases, the drain-source currentI_(ds) increases. Accordingly, the feedback amount ΔV in negativefeedback increases as the mobility μ increases. As seen from FIG. 14B,the feedback amount ΔV₁ of the pixel A whose mobility μ is high ishigher than the feedback amount ΔV₂ of the pixel B whose mobility μ islow.

Therefore, by applying negative feedback to the gate-source voltageV_(gs) by the feedback amount ΔV corresponding to the drain-sourcecurrent I_(ds) of the driving transistor 22 by the mobility correctionprocess, the amount of application of negative feedback increases as themobility μ increases. As a result, the dispersion of the mobility μamong the pixels can be corrected.

In particular, if correction by the feedback amount ΔV₁ is applied tothe pixel A whose mobility μ is high, then the drain-source currentI_(ds) decreases by a greater amount from I_(ds1)′ to I_(ds1). On theother hand, since the feedback amount ΔV₂ to the pixel B whose mobilityμ is low is small, the drain-source current I_(ds) drops from I_(ds2)′to I_(ds2) and does not drop by a great amount. As a result, thedrain-source current I_(ds1) of the pixel A and the drain-source currentI_(ds2) of the pixel B become substantially equal to each other, andconsequently, the dispersion in mobility μ between the pixels iscorrected.

In summary, where a pixel A and a pixel B which are different inmobility μ from each other are available, the feedback amount ΔV₁ of thepixel A whose mobility μ is high is greater than the feedback amount ΔV₂of the pixel B whose mobility μ is low. In other words, as the mobilityμ increases, the feedback amount ΔV increases and the decreasing amountof the drain-source current I_(ds) increases.

Accordingly, by applying negative feedback to the gate-source voltageV_(gs) by the feedback amount ΔV corresponding to the drain-sourcecurrent I_(ds) of the driving transistor 22, the current value of thedrain-source current I_(ds) is uniformized among the pixels havingdifferent values of the mobility μ. As a result, the dispersion inmobility μ among the pixels can be corrected. Thus, a process ofapplying negative feedback to the gate-source voltage V_(gs) of thedriving transistor 22, that is, to the retaining capacitor 24, by thefeedback amount or correction amount ΔV corresponding to the currentflowing through the driving transistor 22, that is, corresponding to thegate-source voltage V_(gs), is the mobility correction process.

2-3. Example of the Configuration of the Driving Circuit Sections

Here, an example of the configuration of the circuit sections disposedaround the pixel array section 30, that is, the driving circuitssections for driving the pixels 20 of the pixel array section 30, isdescribed.

A. Writing Scanning Circuit

First, as one of the driving circuit sections, the writing scanningcircuit 40 for carrying out sequential selection scanning of the pixels20 of the pixel array section 30 in a unit of a row upon writing of thesignal voltage V_(sig)/reference potential V_(ofs) into the pixels 20 isdescribed by way of an example.

FIGS. 15A and 15B show an example of a configuration of the writingscanning circuit 40, and particularly FIG. 15A shows an example of theconfiguration of the writing scanning circuit 40 and FIG. 15B shows anexample of a circuit of a shift register which configures the writingscanning circuit 40.

Referring first to FIG. 15A, the writing scanning circuit 40 basicallyincludes, as a principal component thereof, a shift register circuit 41for successively shifting or transferring a start pulse sp insynchronism with a clock pulse ck not shown. Further, the writingscanning circuit 40 includes buffer circuits . . . , 42 _(i), 42 _(i+1),. . . for individual transfer stages or unit circuits . . . , 41 _(i),41 _(i+1), . . . of the shift register circuit 41 corresponding to therows of the pixel array section 30.

Here, while the shift register circuit 41 shown is configured such thatthe two transfer stages 41 _(i) and 41 _(i+1) of the ith and i+1th rows,actually the shift register circuit 41 includes a number of transferstages 41 ₁ to 41 _(m) equal to the number of rows of the pixel arraysection 30 connected in cascade connection. Each transfer stage of theshift register circuit 41, for example, the transfer stage 41 _(i) ofthe ith row, includes a shift register (SR) 411, an inverter (INV) 412,another shift register 413 and another inverter 414 connected in cascadeconnection to form a unit circuit.

A particular circuit example of the inverters 412 and 414 is hereinafterdescribed. Referring to FIG. 15B, the shift register 413 is configuredfrom a transistor Q₁ which operates with the clock pulse ck, anothertransistor Q₂ which operates with another clock pulse xck and acapacitor C₁. A parasitic capacitor C₂ exists between an output terminalof the shift register 413 and an input terminal of the inverter 414.

Referring back to FIG. 15A, the buffer circuit 42 _(i) is configuredfrom an inverter 421, a logic circuit 422 and another inverter 423connected in cascade connection. In this manner, each of the transferstages 41 _(i) and 41 _(i+1) of the shift register circuit 41 and thebuffer circuits 42 (42 _(i) and 42 _(i+1)) is configured using aninverter circuit.

B. Inverter Circuit of a One-Sided Channel Transistor

Incidentally, upon fabrication of the driving circuit sections such asthe writing scanning circuit 40, if the driving circuit sections areconfigured using transistors of a one-sided channel (only of an Nchannel or of a P channel), then the fabrication cost can be reduced incomparison with that in an alternative case wherein they are configuredusing both-sided channels. Accordingly, in order to reduce the cost ofthe display apparatus 10, for example, in the writing scanning circuit40, inverter circuits which configure the shift register circuit 41 orthe buffer circuits 42 is preferably configured using transistors of aone-sided channel.

In the case where an inverter circuit is configured using transistors ofa one-sided channel, in order to make circuit operation of the invertercircuit sure, a circuit configuration based on a combination oftransistors of a one-sided channel and a capacitance element is adopted.In the following, for example, an inverter circuit formed from acombination of transistors of a one-sided channel and capacitanceelements to be used as the inverters 412 and 414 which configure theshift register circuit 41 is described.

Circuit Configuration

FIGS. 16A and 16B show an inverter circuit formed from a combination oftransistors of a one-sided channel and capacitance elements, andparticularly FIG. 16A shows an example of the circuit configuration andFIG. 16B illustrates waveforms of an input pulse signal INV_(in) and theoutput pulse signal INV_(out).

The inverter circuit 90 in the present circuit example substantiallyinverts the input pulse signal INV_(in) inputted thereto through aninput terminal 91 and outputs a pulse signal INV_(out) of a phaseopposite to that of the input pulse signal INV_(in) from an outputterminal 92. This inverter circuit 90 uses, as power supply voltages,for example, four power supply voltages V_(cc1), V_(cc2), V_(cc3) andV_(cc4) for the positive side and, for example, four power supplyvoltages V_(ss1), V_(ss2), V_(ss3) and V_(ss4) for the negative side.However, the power supply voltages mentioned here are a mere example,and the power supply voltages are not limited to them. A smaller numberof power supply voltages may be used, or it is possible to use one powersupply voltage for each of the positive and negative sides.

The inverter circuit 90 is configured such that it includes, forexample, seven transistors Tr₁ to Tr₇, five capacitance element C₁ to C₅and a delay circuit 93. The seven transistors Tr₁ to Tr₇ are MOS (MetalOxide Semiconductor) thin film transistors, that is, TFTs, of the samechannel or one-sided channel such as, for example, the N channel. Whileit is described here that transistors only of the N channel are used asthe transistors Tr₁ to Tr₇, also it is possible to use transistors onlyof the P channel.

The transistor Tr₁ is connected at the drain electrode thereof to apower supply line L₁₂ of the positive side power supply voltage V_(cc2)and at the source electrode thereof to a node N₁ and receives a voltagecorresponding to an input voltage, that is, the input pulse signalINV_(in), inputted through the input terminal 91 as a gate input. Thetransistor Tr₂ is connected at the drain electrode thereof to a powersupply line L₁₃ of the positive side power supply voltage V_(cc3), atthe source electrode thereof to a node N₂ and at the gate electrodethereof to the node N₁. The transistor Tr₃ is connected at the drainelectrode thereof to a power supply line L₁₄ of the positive side powersupply voltage V_(cc4), at the source electrode thereof to an outputterminal 92 and at the gate electrode thereof to the node N₂.

The delay circuit 93 is configured, for example, from two transistorsTr₉₁ and Tr₉₂ connected in parallel to each other. Naturally, the twotransistors Tr₉₁ and Tr₉₂ are N-channel MOS transistors similarly to thetransistors Tr₁ to Tr₇. The transistors Tr₉₁ and Tr₉₂ are connectedcommonly at one of the electrodes, that is, at the source electrode orthe drain electrode thereof, and the one electrode serves as a circuitinput terminal of the delay circuit 93 while the other electrode, thatis, the drain electrode or the source electrode, serves as a circuitoutput terminal of the delay circuit 93.

In the delay circuit 93, the circuit input terminal is connected to theinput terminal 91. Also the transistor Tr₉₁ is connected at the gateelectrode thereof to the input terminal 91. The transistor Tr₉₂ isconnected at the gate electrode thereof to a power supply line L₁₁ ofthe positive side power supply voltage V_(cc1).

The transistor Tr₄ is connected at the drain electrode thereof to thegate electrode of the transistor Tr₁, at the gate electrode thereof to apower supply line L₂₁ of the negative side power supply voltage V_(ss1)and at the gate electrode thereof to the circuit output terminal of thedelay circuit 93. The transistor Try is connected at the drain electrodethereof to the node N₁ and at the source electrode thereof to a powersupply line L₂₂ of the negative side power supply voltage V_(ss2). Inother words, the transistor Tr₅ is connected in series to the transistorTr₁ and connected at the gate electrode thereof to the input terminal91.

The transistor Tr₆ is connected at the drain electrode thereof to thenode N₂ and at the source electrode thereof to a power supply line L₂₃of the negative side power supply voltage V_(ss3). In other words, thetransistor Tr₆ is connected in series to the transistor Tr₂ andconnected at the gate electrode thereof to the input terminal 91. Thetransistor Tr₇ is connected at the drain electrode thereof to the outputterminal 92, at the source electrode thereof to a power supply line L₂₄of the negative side power supply voltage V_(ss4) and at the gateelectrode thereof to the input terminal 91.

The capacitor C₁ is connected at one terminal thereof to the gateelectrode of the transistor Tr₁ and at the other terminal thereof to thenode N₁. In other words, the capacitor C₁ is connected between the gateand the source of the transistor Tr₁. The parasitic capacitor C₂ isconnected at one electrode thereof to the node N₁ and at the otherelectrode thereof to the input terminal 91. The node N₁ is a commonconnection node of the transistor Tr₁ and the transistor Tr₅.

The capacitance element C₃ is connected at one electrode thereof to thegate electrode of the transistor Tr₂ and at the other electrode thereofto the node N₂. The capacitance element C₄ is connected at one terminalthereof to the gate electrode of the transistor Tr₃ and at the otherelectrode thereof to the output terminal 92. The capacitance element C₅is connected at one electrode thereof to the gate electrode of thetransistor Tr₄ and at the other electrode thereof to the power supplyline L₂₁ of the negative side power supply voltage V_(ss1).

Here, the delay circuit 93 configured from the transistors Tr₉₁ and Tr₉₂has a role of a high resistance element which interconnects the inputterminal 91 and the gate electrode of the transistor Tr₄. Consequently,the input pulse signal INV_(in) inputted through the input terminal 91passes through the delay circuit 93, whereupon a variation of thepotential of the input pulse signal INV_(in) is transmitted after adelay in time to the gate electrode of the transistor Tr₄. The delayamount of the delay circuit 93 can be controlled by changing the voltagevalue of the positive side power supply voltage V_(cc1) and thecapacitance value of the capacitance element C₅.

The transistor Tr₁ electrically connects or disconnects the power supplyline L₁₂ of the positive side power supply voltage V_(cc2) to or fromthe node N₁ in response to a voltage across the capacitor C₁. Thetransistor Tr₂ electrically connects or disconnects the power supplyline L₁₃ of the positive side power supply voltage V_(cc3) and the nodeN₂ in response to the potential difference between the potential of thenode N₁ and the potential of the node N₂, that is, in response to avoltage across the capacitance element C₃. The transistor Tr₃electrically connects or disconnects the power supply line L₁₄ of thepositive side power supply voltage V_(cc4) to or from output terminal 92in response to the potential difference between the potential of thenode N₂ and the potential of the output terminal 92, that is, inresponse to a voltage across the capacitance element C₄.

The transistor Tr₄ electrically connects or disconnects the gateelectrode of the transistor Tr₁ to or from the power supply line L₂₁ ofthe negative side power supply voltage V_(ss1) in response to thepotential difference between the potential at the output terminal of thedelay circuit 93 and the negative side power supply voltage V_(ss1),that is, in response to a voltage across the capacitance element C₅. Thetransistor Tr₅ electrically connects or disconnects the node N₁ to orfrom the power supply line L₂₂ of the negative side power supply voltageV_(ss2) in response to the potential difference between the potential ofthe input terminal 91 and the negative side power supply voltageV_(ss2). The transistor Tr₆ electrically connects or disconnects thenode N₂ to or from the power supply line L₂₂ of the negative side powersupply voltage V_(ss3) in response to the potential difference betweenthe potential of the input terminal 91 and the negative side powersupply voltage V_(ss3). The transistor Tr₇ electrically connects ordisconnects the output terminal 92 to or from the power supply line L₂₄of the negative side power supply voltage V_(ss4) in response to thepotential difference between the potential of the input terminal 91 andthe negative side power supply voltage V_(ss4).

Circuit Operation

Now, circuit operation when the input pulse signal INV_(in) inputtedthrough the input terminal 91 to the inverter circuit 90 having theconfiguration described above is placed into an active state or highpotential state and into an inactive state or low potential state isdescribed.

When the input pulse signal INV_(in) is placed into an active state:

If the input pulse signal INV_(in) is placed into an active state, thenthe gate potential of the transistor Tr₇ is placed into a high potentialstate and the transistor Tr₇ is placed into a conducting state.Therefore, the negative side power supply voltage V_(ss4) is led out asthe low potential of the output pulse signal INV_(out) from the outputterminal 92. Simultaneously, also the transistors Tr₅ and Tr₆ are placedinto conducting state, and consequently, the potentials at the nodes N₁and N₂ are fixed to the negative side potentials V_(ss2) and V_(ss3),respectively.

Consequently, both of the transistors Tr₂ and Tr₃ are placed into anon-conducting state. Further, the transistor Tr₄ is placed into aconducting state in response to a delay output of the delay circuit 93,and consequently, the gate potential of the transistor Tr₁ is fixed tothe negative side power supply voltage V_(ss1). Consequently, also thetransistor Tr₁ is placed into a non-conducting state. In other words,when the input pulse signal INV_(in) is placed into an active state,then all of the positive side transistors Tr₁, Tr₂ and Tr₃ are placedinto a non-conducting state.

When the input pulse signal INV_(in) is placed into an inactive state:

If the input pulse signal INV_(in) is placed into an inactive state,then all of the transistors Tr₅, Tr₆ and Tr₇ on the negative potentialside are simultaneously placed into a non-conducting state. In addition,the potential at the node N₁, that is, the gate potential of thetransistor Tr₂, drops by capacitive coupling of the parasitic capacitorC₂ in accordance with the variation amount when the input pulse signalINV_(in) transits from the high potential to the low potential.

At the instant of the potential drop by the capacitive coupling, thegate potential of the transistor Tr₄ keeps a high potential state due toa delay by the delay circuit 93, and therefore, the gate potential ofthe transistor Tr₁ is in the state of the negative side power supplyvoltage V_(ss1). Accordingly, the gate-source voltage V_(gs) of thetransistor Tr₁ increases in response to the potential drop at the nodeN₁ until it exceeds the threshold voltage, whereupon the transistor Tr₁is placed into a conducting state. Consequently, the potential at thenode N₁ rises to the positive side power supply voltage V_(cc1).

Consequently, since also the gate-source voltage V_(gs) of thetransistor Tr₂ increases, also the transistor Tr₂ is placed into aconducting state. As a result, the potential at the node N₂ rises to thepositive side power supply voltage V_(cc2) and also the gate-sourcevoltage V_(gs) of the transistor Tr₂ increases, and consequently, thetransistor Tr₃ is placed into a conducting state following thetransistor Tr₂. Then, when the transistor Tr₃ is placed into aconducting state, the positive side power supply voltage V_(cc4) is ledout as a positive potential of the pulse signal INV_(out) from theoutput terminal 92.

Here, in order to allow the transistor Tr₁ to be placed into aconducting state more rapidly in response to a drop of the gatepotential of the transistor Tr₂ by the capacitive coupling of theparasitic capacitor C₂, the capacitance value of the parasitic capacitorC₂ is set to a rather high level. Then, if the transistor Tr₁ enters aconducting state rapidly, then the transition timing, that is, therising/falling timing, of the pulse signal INV_(out) can be defined moreaccurately.

The transition timing of the output pulse signal INV_(out) defines thepulse width of output pulse signal INV_(out). Then, in the case wherethe driving circuit section is the writing scanning circuit 40, theoutput pulse signal INV_(out) is used as a reference signal forgeneration of the writing scanning signal WS. Accordingly, the pulsewidth of the output pulse signal INV_(out) makes a reference for thedetermination of the pulse width of the writing scanning signal WS andmakes a reference for the determination of the operation time of themobility correction process described hereinabove, that is, the mobilitycorrection time.

Here, even if the pulse width of the writing scanning signal WS when theoptimum mobility correction time is long and the pulse width of thewriting scanning signal WS when the optimum mobility correction time isshort exhibit an equal amount or time period of dispersion, thedispersion of the pulse width of the writing scanning signal WS when theoptimum mobility correction time is short is relatively great. Then, thedispersion of the pulse width of the writing scanning signal WS makes aluminance dispersion and makes a cause of deterioration of the picturequality. Also from such a point of view, it is significant to set thecapacitance value of the parasitic capacitor C₂ to a high level to allowthe transistor Tr₁ to enter a conducting state rapidly thereby toaccurately define the transition timing of the output pulse signalINV_(out) which makes a reference for the determination of the mobilitycorrection time.

As apparent from the foregoing description of the circuit operation, inthe inverter circuit 90 configured from transistors of a one-sidedchannel, in order to make circuit operation sure, the parasiticcapacitor C₂ for dropping the potential of the node N₁ by capacitivecoupling is used. In addition to the parasitic capacitor C₂, also thecapacitance elements C₁, C₂ and C₄ for retaining the gate-source voltageV_(gs) of the transistors Tr₁, Tr₂ and Tr₃ are used. The capacitanceelements C₁ to C₄ are used in an inverter circuit configured fromtransistors of a one-sided channel.

The inverter circuit 90 described above which is configured from acombination of transistors of a one-sided channel and capacitanceelements can be used not only as the inverters 412 and 414 whichconfigure the shift register circuit 41 of the writing scanning circuit40 show in FIG. 15A but also as the inverters 421, 423 and so forthwhich configure the buffer circuits 42. Since also the power supplyscanning circuit 50 is configured basically similarly to the writingscanning circuit 40, the inverter circuit 90 can be used also as aninverter which configures the power supply scanning circuit 50.

C. Signal Outputting Circuit

Now, as one of the driving circuit sections, the signal outputtingcircuit 60 which selectively outputs a signal voltage V_(sig)/referencepotential V_(ofs) in accordance with luminance information to the pixels20 of a pixel row selectively scanned by the writing scanning circuit 40is described.

FIG. 17 shows an example of a configuration of the signal outputtingcircuit 60. The signal outputting circuit 60 of the present exampleadopts a time-divisional driving method or selector method wherein avideo signal DATA supplied in a time sequence through a data line issupplied time-divisionally in a unit of a plurality of pixel columns.Here, a time-divisional driving method wherein a video signal DATA ofRGB is supplied time-divisionally in a unit of three pixel columns orsignal lines corresponding to R, G and B is described as an example.

Referring to FIG. 17, two selection switches 61 _(R) and 62 _(R) areconnected commonly at an output terminal thereof to one end of a signalline 33 _(i−1) of R. Two selection switches 61 _(G) and 62 _(G) areconnected commonly at an output terminal thereof to en end of a signalline 33 _(i) of G. Two selection switches 61 _(B) and 62 _(B) areconnected commonly at an output terminal thereof to an end of the signalline 33 _(i+1) of B.

The selection switches 61 _(R), 61 _(G) and 61 _(B) and the selectionswitches 62 _(R), 62 _(G) and 62 _(B) are configured, for example, froman Nch MOS transistor. However, the selection switches 61 _(R), 61 _(G)and 61 _(B) and the selection switches 62 _(R), 62 _(G) and 62 _(B) mayotherwise be configured from a Pch MOS transistor or else may beconfigured from Nch MOS transistors and Pch MOS transistors connected inparallel.

The video signal DATA is a time-sequential signal by which signalvoltages of RGB are supplied, for example, in the order of R, G and B,and is applied commonly to input terminals of the selection switches 61_(R), 61 _(G) and 61 _(B) from a driver IC or signal generation sectionnot shown through a data line 63. The reference potential V_(ofs) isapplied commonly to input terminals of the selection switches 62 _(R),62 _(G) and 62 _(B) from a reference potential generation section notshown through a signal line 64 ₅.

The selection switches 61 _(R), 61 _(G) and 61 _(B) are connected at thegate thereof to control lines 64 ₁, 64 ₂ and 64 ₃, respectively. Theselection switches 62 _(R), 62 _(G) and 62 _(B) are connected at thegate thereof commonly to a control line 64 ₄. To the control lines 64 ₁,64 ₂, 64 ₃ and 64 ₄, switch control signals SEL_(R), SEL_(G), SEL_(B)and GATE_(ofs) are applied, respectively, from a timing generationsection not shown.

The switch control signal SEL_(R) is rendered active, that is, placedinto a high level, in synchronism with the signal voltage of R fromwithin the time-sequential signal. The switch control signal SEL_(G) isrendered active in synchronism with the signal voltage of G from withinthe time-sequential signal. The switch control signal SEL_(B) isrendered active in synchronism with the signal voltage of B from withinthe time-sequential signal. The switch control signal GATE_(ofs) isrendered active at a writing timing of the reference potential V_(ofs)described hereinabove.

In the configuration described above, the selection switch 61 _(R) isplaced into a conducting state in response to the switch control signalSEL_(R) to select the signal voltage of R and outputs the signal voltageof R to the signal line 33 _(i−1). The selection switch 61 _(G) isplaced into a conducting state in response to the switch control signalSEL_(G) to select the signal voltage of G and outputs the signal voltageof G to the signal line 33 _(i). The selection switch 61 _(B) is placedinto a conducting state in response to the switch control signal SEL_(B)to select the signal voltage of B and outputs the signal voltage of B tothe signal line 33 _(i+1). The selection switches 62 _(R), 62 _(G) and62 _(B) are placed into a conducting state in response to the switchcontrol signal GATE_(ofs) to select and output the reference potentialV_(ofs) to the signal lines 33 _(i−1), 33 _(i) and 33 _(i+1),respectively.

In the organic EL display apparatus 10 _(A) according to the presentapplication described above, the writing scanning circuit 40, powersupply scanning circuit 50 and signal outputting circuit 60 correspondto the peripheral driving sections 80 _(A) to 80 _(C) of the displayapparatus 10 in the embodiment described hereinabove, respectively(refer to FIGS. 1, 4A, 4B and 7). Then, for example, in FIG. 7, in orderto electrically connect the peripheral driving sections 80 _(A) to 80_(C) and the outside of the substrate to each other, the pad portions 84_(A) and 84 _(B), pad portion group 84 _(C) and pads 84 _(D) and 84 _(E)are used.

In particular, referring to FIG. 18, the peripheral driving section 80_(A) mounted on the substrate end portion 70 _(B) corresponds to thewriting scanning circuit 40; the peripheral driving section 80 _(B)mounted on the board end portion 70 _(C) corresponds to the power supplyscanning circuit 50; and the peripheral driving section 80 _(C) mountedon the substrate end portion 70 _(D) corresponds to the signaloutputting circuit 60. FIG. 18 corresponds to FIG. 7.

The writing scanning circuit 40 which is the peripheral driving section80 _(A) is electrically connected, for example, at a pad portion 84 _(A)provided at an upper end portion 70 _(B0) of the substrate end portion70 _(B), to the outside of the substrate, for example, through aflexible board 87 _(A). Then, to the writing scanning circuit 40, apower supply voltage and the clock pulse ck, start pulse sp and so forthdescribed hereinabove are inputted from the outside of the substratethrough the flexible board 87 _(A) and the pad portion 84 _(A).

The power supply scanning circuit 50 which is the peripheral drivingsection 80 _(B) is electrically connected, for example, at a pad portion84 _(B) provided at an upper end portion 70 _(C0) of the substrate endportion 70 _(C), to the outside of the substrate, for example, through aflexible board 87 _(B). Then, to the power supply scanning circuit 50, apower supply voltage and the clock pulse ck, start pulse sp and so forthdescribed hereinabove are inputted from the outside of the substratethrough the flexible board 87 _(B) and the pad portion 84 _(B) similarlyto the writing scanning circuit 40.

The signal outputting circuit 60 which is the peripheral driving section80 _(C) is electrically connected, at the pad portion group 84 _(C)provided on the substrate end portion 70 _(D), to a driver IC 88, whichis a signal supplying source provided on the outside of the substrate,for example, through a flexible board group 87 _(C). Then, to the signaloutputting circuit 60, the signal voltage V_(sig) of a video signal isinputted from the driver IC 88 through the flexible board group 87 _(C)and the pad portion group 84 _(C).

Further, the signal outputting circuit 60 is electrically connected, atthe pad portions 84 _(D) and 84 _(E) provided at the opposite endportions 70 _(D1) and 70 _(D2) of the substrate end portion 70 _(D), tothe outside of the substrate, for example, through the flexible boards87 _(D) and 87 _(E), respectively. Then, to the signal outputtingcircuit 60, signals for controlling the signal outputting circuit 60 areinputted from the outside of the substrate through the flexible boards87 _(D) and 87 _(E) and the pad portions 84 _(D) and 84 _(E).

In particular, if it is assumed that the signal outputting circuit 60adopts the time-divisional driving method as seen from FIG. 17, thengate controlling signals for controlling the transistors which configurethe selection switches 61 _(R), 61 _(G) and 61 _(B) and the selectionswitches 62 _(R), 62 _(G) and 62 _(B) are inputted. Here, the gatecontrolling signals are the switch control signals SEL_(R), SEL_(G),SEL_(B) and GATE_(ofs) described hereinabove. To the signal outputtingcircuit 60, the reference potential V_(ofs) is inputted from the outsideof the substrate through the flexible boards 87 _(D) and 87 _(E) and thepad portions 84 _(D) and 84 _(E) in addition to the gate controllingsignals.

Here, in the case where the peripheral driving section 80 _(C)particularly is the signal outputting circuit 60, the pad portion group84 _(C) for fetching a video signal from the outside of the substratefor each pixel column of the pixel array section 30 is provided at alower end of the substrate end portion 70 _(D) substantiallycorresponding to the pixel column over the width of the pixel arraysection 30 in the horizontal direction. Besides, since the distancebetween the folding region and the signal outputting circuit 60 issmall, wiring lines of a peripheral circuit section cannot be laid.

From such a reason as just described, a space in which pad portions forfetching gate controlling signals, that is, the switch control signalsSEL_(R), SEL_(G), SEL_(B) and GATE_(ofs) and the reference potentialV_(ofs) from the outside of the substrate are to be provided cannot beassured on the substrate end portion 70 _(D). Accordingly, the padportions 84 _(D) and 84 _(E) for fetching the gate controlling signalsand the reference potential V_(ofs) from the outside of the substrate tothe signal outputting circuit 60 are provided at a location in thesubstrate end portion 70 _(D) on the substrate end portion 70 _(D)farther than the bent portion, that is, at the opposite end portions 70_(D1) and 70 _(D2). In other words, by providing the pad portions 84_(D) and 84 _(E) at the opposite end portions 70 _(D1) and 70 _(D2) ofthe substrate end portion 70 _(D), even if the distance between thefolding region and the signal outputting circuit 60 is small, the gatecontrolling signals and the reference potential V_(ofs) can be providedwith certainty from the outside of the substrate to the signaloutputting circuit 60.

3. Modification

In the application described above, the disclosed technology is appliedto the organic EL display apparatus 10 _(A) which is configured suchthat the scanning circuit sections, that is, the writing scanningcircuit 40 and the power supply scanning circuit 50, are provided in thedisplay panel 70, particularly mounted on the substrate end portions 70_(B) and 70 _(C). However, the disclosed technology is not limited tothe application example described above.

In particular, the disclosed technology can be applied similarly also toan organic EL display apparatus 10 _(B) which is configured such that,as seen in FIG. 19, the writing scanning circuit 40 and the power supplyscanning circuit 50 are not built therein but external drivers are used.In this instance, pad portion groups 84 _(F) and 84 _(G) may be disposedon the substrate end portions 70 _(B) and 70 _(C) such that the pixelarray section 30 and the outside of the substrate are electricallyconnected through the pad portion groups 84 _(F) and 84 _(G).

Further, while, in the application example described above, thedisclosed technology is applied to an organic EL display apparatus whichuses an organic EL element as an electro-optical element of the pixel20, the disclosed technology is not limited to the application example.In particular, the disclosed technology can be applied to variousdisplay apparatus wherein elect-optical elements or light emittingelements such as inorganic EL elements, LED elements or semiconductorlaser elements are used.

4. Electronic Apparatus

The display apparatus of the embodiment of the disclosed technologydescribed above can be applied as a display apparatus for electronicapparatus in various fields wherein a video signal inputted to theelectronic apparatus or a video signal generated in the electronicapparatus is displayed as an image or a picture. For example, thedisclosed technology can be applied to such various electronic apparatusas shown in FIGS. 20 to 24A to 24G, for example, to a digital camera, anotebook type personal computer, a portable terminal apparatus such as aportable telephone set and a video camera.

In this manner, the display apparatus according to the embodiment of thedisclosed technology can be used as a display apparatus in electronicapparatus in various fields. As apparent from the foregoing descriptionof the embodiments, the display apparatus according to the embodiment ofthe disclosed technology can achieve further reduction of the width ofthe framework molding of the display panel without limiting thefunctions of the peripheral circuit sections for driving pixels of thepixel array section. Accordingly, if the display apparatus of theembodiment of the disclosed technology is used as the display apparatusin various electronic apparatus, then a compact form of the displayapparatus can be achieved while the picture quality is maintained.

The display apparatus of the embodiment of the disclosed technology maybe formed as of a module type wherein it is encapsulated. For example,the display apparatus may have a form of a display module wherein, forexample, a transparent opposing member of glass or the like is pasted tothe pixel array section 30. A color filter, a protective film or thelike may be provided on the transparent opposing member. It is to benoted that, on the display module, a circuit section, an FPC (flexibleprinted circuit) or the like for inputting and outputting signals and soforth from the outside to the pixel array section and vice versa.

In the following, particular examples of an electronic apparatus towhich the disclosed technology is applied are described.

FIG. 20 shows an appearance of a television receiver to which thedisclosed technology is applied. Referring to FIG. 20, the televisionreceiver includes a video signal display face section 101 configuredfrom a front panel 102, a filter glass plate 103 and so forth and isproduced using the display apparatus of the embodiment of the disclosedtechnology as the video signal display face section 101.

FIGS. 21A and 21B show an appearance of a digital camera to which thedisclosed technology is applied as viewed from the front side and therear side, respectively. Referring to FIGS. 21A and 21B, the digitalcamera shown includes a flash light emitting section 111, a displaysection 112, a menu switch 113, a shutter 114 and so forth. The digitalcamera is produced using the display apparatus of the embodiment of thedisclosed technology as the display section 112.

FIG. 22 shows an appearance of a notebook type personal computer towhich the disclosed technology is applied. Referring to FIG. 22, thenotebook type personal computer shown includes a body 121, a keyboard122 for being operated in order to input characters and so forth, adisplay section 123 for displaying an image and so forth. The notebooktype personal computer is produced using the display apparatus of theembodiment of the disclosed technology as the display section 123.

FIG. 23 shows an appearance of a video camera to which the disclosedtechnology is applied. Referring to FIG. 23, the video camera shownincludes a may body section 131, and a lens 132 provided on a side facedirected forwardly for picking up an image of an image pickup object.The video camera further includes a start/stop switch 133 for imagepickup, a display section 134 and so forth. The video camera is producedusing the display apparatus of the embodiment of the disclosedtechnology as the display section 134.

FIGS. 24A to 24G show a portable terminal apparatus, as a portabletelephone set, for example, to which the disclosed technology isapplied. Referring to FIGS. 24A to 24G, the portable terminal apparatusincludes an upper side housing 141, a lower side housing 142, aconnection section 143 in the form of a hinge section, a display section144, a sub display section 145, a picture light 146, a camera 147 and soforth. The portable telephone set is produced using the displayapparatus of the embodiment of the disclosed technology as the displaysection 144 and/or the sub display section 145.

The present disclosure contains subject matter related to that disclosedin Japanese Priority Patent Application JP 2010-276940 filed in theJapan Patent Office on Dec. 13, 2010, the entire content of which ishereby incorporated by reference.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors in so far as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A display apparatus, comprising: a foldable firstsubstrate; a pixel array including a plurality of pixels on a centralportion of the first substrate, respective ones of the plurality ofpixels comprising an electro-optical device; a peripheral circuit formedoutside of the pixel array and configured to drive the pixel array; padson a peripheral portion of the first substrate and connected to theperipheral circuit; a flexible board connected to the pads; a circuitsection configured to drive the electro-optical device and including acircuit element formed on the first substrate; a flattening film and awindow insulation film laminated on the circuit element; and a secondsubstrate disposed above the flattening film and the window insulationfilm in a region of the first substrate, wherein the first substrate isfolded such that the flexible board partially overlaps the centralportion of the first substrate, and the flexible board is disposed underthe pixel array.
 2. The display apparatus according to claim 1, whereinthe peripheral circuit partially overlaps the central portion of thefirst substrate, and the peripheral circuit is disposed under the pixelarray.
 3. The display apparatus according to claim 1, wherein the firstsubstrate is folded such that the pads are disposed under the pixelarray.
 4. The display apparatus according to claim 1, wherein theperipheral circuit includes at least one of a writing scanning circuit,a power supply scanning circuit, or a signal outputting circuit.
 5. Thedisplay apparatus according to claim 1, wherein the pads are provided ata location on the peripheral portion of the first substrate that isfarther than a folding portion at which the first substrate is folded.6. The display apparatus according to claim 1, wherein the peripheralcircuit is configured to receive a signal from outside of the firstsubstrate.
 7. The display apparatus according to claim 6, wherein theperipheral circuit is configured to receive the signal via the flexibleboard.
 8. The display apparatus according to claim 1, wherein theelectro-optical device is an organic electroluminescent element.
 9. Thedisplay apparatus according to claim 1, wherein circuit element includesa plurality of transistors.
 10. The display apparatus according to claim9, wherein the plurality of transistors includes at least a drivingtransistor and a writing transistor.
 11. An electronic apparatus,comprising: a display apparatus configured to display an image inresponse to a video signal, the display apparatus including: a foldablefirst substrate, a pixel array including a plurality of pixels on acentral portion of the first substrate, respective ones of the pluralityof pixels comprising an electro-optical device, a peripheral circuitformed outside of the pixel array and configured to drive the pixelarray, pads on a peripheral portion of the first substrate and connectedto the peripheral circuit, a flexible board connected to the pads, acircuit section configured to drive the electro-optical device andincluding a circuit element formed on the first substrate, a flatteningfilm and a window insulation film laminated on the circuit element, anda second substrate disposed above the flattening film and the windowinsulation film in a region of the first substrate, wherein the firstsubstrate is folded such that the flexible board partially overlaps thecentral portion of the first substrate, and the flexible board isdisposed under the pixel array.
 12. The electronic apparatus accordingto claim 11, wherein the peripheral circuit partially overlaps thecentral portion of the first substrate, and the peripheral circuit isdisposed under the pixel array.
 13. The electronic apparatus accordingto claim 11, wherein the first substrate is folded such that the padsare disposed under the pixel array.
 14. The electronic apparatusaccording to claim 11, wherein the peripheral circuit includes at leastone of a writing scanning circuit, a power supply scanning circuit, or asignal outputting circuit.
 15. The electronic apparatus according toclaim 11, wherein the pads are provided at a location on the peripheralportion of the first substrate that is farther than a folding portion atwhich the first substrate is folded.
 16. The electronic apparatusaccording to claim 11, wherein the peripheral circuit is configured toreceive a signal from outside of the first substrate.
 17. The electronicapparatus according to claim 16, wherein the peripheral circuit isconfigured to receive the signal via the flexible board.
 18. Theelectronic apparatus according to claim 11, wherein the electro-opticaldevice is an organic electroluminescent element.
 19. The electronicapparatus according to claim 11, wherein circuit element includes aplurality of transistors.
 20. The electronic apparatus according toclaim 19, wherein the plurality of transistors includes at least adriving transistor and a writing transistor.